Performance Materials
Copper-Nickel-Silicon Alloys
Cu-Ni-Si · high conductivity + strength · beryllium-free
Hardenable copper-nickel-silicon alloys pair high thermal and electrical conductivity with high mechanical and friction resistance. Stable at elevated temperature with low stress relaxation, the NS30 grade exceeds copper-beryllium on thermal performance, ideal for hot friction parts, mould tooling and resistance welding.
Beryllium-free CuBe2 substituteCW111C2.0855RWMA Class 3NFL 14701DTD 498Lead-free
Why Copper-Nickel-Silicon Alloys
Key characteristics.
Conductivity + strength
High thermal / electrical conductivity with mechanical strength.
Hot friction & wear
Suited to friction applications in hot environments.
Thermal stability
Elevated-temperature stability and low stress relaxation.
Be- & lead-free
An eco-friendly substitute for copper-beryllium.
Products · branded grades & forms
4 product lines, one chemistry family.
Matched to the temper, form and spec your program requires.
Available formsBarsStrips
All values from the LBA NA catalogue. Spec values are indicative. Confirm against certified datasheets.
Where it's used · core markets
